化工新型材料

化工新型材料 ›› 2020, Vol. 48 ›› Issue (1) : 1-5.

综述与专论

LED封装用复合材料研究进展

^1,3*

作者信息 +

Progress of LED packaging composite materials

Huang Yufeng¹, Sun Xujun², Han Ying², Liu Dongshun², Tan Xiaohua², Feng Yakai^1,3

Author information +

文章历史 +

Received		Published
2018-07-19		2020-01-20
Issue Date	Revised Date
2020-02-11	2018-07-19

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摘要

传统的发光二极管(LED)封装材料主要分为环氧树脂与有机硅树脂,它们存在易黄变、易老化、耐候性差和折射率低等诸多缺点。一些具有高折射率、紫外吸收性能优良的纳米金属氧化物(如二氧化钛、二氧化硅、氧化锌和二氧化锆等)与环氧树脂或有机硅树脂进行复合,不仅能大幅度提高封装材料的折射率,还能提高材料的热稳定性和机械性能。综述近年来无机纳米粒掺杂硅树脂或环氧树脂的制备方法,分析评估其工艺与封装材料性能,并介绍了国内外LED封装用有机无机复合材料的研究进展。

Abstract

The traditional LED packaging materials are mainly divided into epoxy resins and silicone resins.They have some disadvantages such as easy yellowing,easy aging,poor weather ability and low refractive index,etc.Some metal oxides nanoparticles (titanium dioxide,silica,zinc oxide,zirconium dioxide,etc.) with high refractive index and ultraviolet absorption properties are compounded with epoxy resins or silicone resins,which can not only substantially increase the refractive index of the materials,but also improve their thermal stability and mechanical properties as an inorganic filler.The relevant reports in recent years on the preparation methods of inorganic nanoparticles doped silicon or epoxy resins were reviewed.The process and properties of the materials were analyzed and evaluated.The research progress of organic and inorganic composites for LED packaging at home and abroad was also reviewed.

关键词

发光二极管封装 / 复合材料 / 共混法 / 溶胶-凝胶法

Key words

LED packaging / composite / blending / sol-gel process

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LED封装用复合材料研究进展[J]. 化工新型材料, 2020, 48(1): 1-5 DOI:

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