聚苯乙烯(PS)导电球因兼具高分子微球的形态可控性与导电材料的优异电学性能,在电子封装、智能传感及能源等领域具有重要应用价值。为系统梳理其制备技术、应用现状与发展方向,综述了PS导电球的三大制备方法:化学镀法通过复杂的预处理在PS球表面沉积金属获得导电性优异核壳球,但工艺繁琐;层层自装法利用静电或π-π作用将导电材料组装于PS表面在较低渗流阈值下实现高导电性;原位聚合法通过磺化改性或功能单体共聚在PS导电球表面聚合导电聚合物,工艺相对简化且包覆可控。PS导电球作为各向异性导电膜的关键填料在微电子封装中保障了可靠性;还可通过构建三维导电网络实现对交通荷载、人体运动的高灵敏监测;作为模板构筑多孔结构的对电极或碳电极以提升电池效率等。面向未来,PS导电球正朝着多功能化、高精度化、柔性自修复以及绿色低成本方向发展,以应对柔性电子、高端封装与可持续发展对材料性能的更高需求。
Polystyrene (PS) conductive spheres,which combine the controllable morphology of polymer microspheres with the excellent electrical properties of conductive materials,hold significant application value in fields such as electronic packaging,intelligent sensing,and energy.To systematically review their preparation techniques,application status,and development directions,this paper summarized three major preparation methods for PS conductive spheres.The electroless plating method deposits metals on the surface of PS spheres through complex pretreatment processes to obtain core-shell spheres with excellent conductivity,but the process is cumbersome.The layer-by-layer self-assembly method utilizes electrostatic or π-π interactions to assemble conductive materials on the PS surface,achieving high conductivity at a low percolation threshold.The in-situ polymerization method involves polymerizing conductive polymers on the surface of PS spheres through sulfonation modification or functional monomer copolymerization,offering a relatively simplified process and controllable coating.As a key filler in anisotropic conductive films,PS conductive spheres ensure reliability in microelectronic packaging.They also enable high-sensitivity monitoring of traffic loads and human body movements by constructing three-dimensional conductive networks.Furthermore,they serve as templates to fabricate porous structured counter electrodes or carbon electrodes,thereby enhancing battery efficiency.Looking ahead,PS conductive spheres are advancing towards multifunctionality,high precision,flexible self-healing properties,and green low-cost approaches to meet the increasing demands of flexible electronics,high-end packaging,and sustainable development for material performance.
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基金资助
湖南省自然基金区域联合项目(2024JJ7111);湖南省自然科学青年基金项目(2025JJ60305);湖南省研究生科研创新项目(CX20251756);湖南工程学院研究生科研创新项目(YC202511)
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