由于5G牌照的正式签发,作为通讯设备的核心材料印制线路板(PCB)则需要尽快地做出产品的升级换代和技术革新。印制线路板的基材覆铜板(CCL)的性能主要是由基体树脂和增强材料的性能决定。因此介绍了高性能覆铜板对基材的介电性能要求,阐述了聚苯醚(PPO)基材的综合性能,归纳了聚苯醚的改性方法,列举了聚苯醚树脂在高频线路中的应用现状。
Due to the formal issuance of 5G licenses,printed circuit boards (PCBs),as a core material of communication equipment,needs to be upgraded and technologically innovated as soon as possible.The performance of the base material copper clad laminate (CCL) of the printed circuit board is mainly determined by the performance of the matrix resin and the reinforcing material.Therefore,in this article,the dielectric performance requirements of high-performance copper clad laminates for the substrate were introduced,the comprehensive performance of the polyphenylene ether (PPO) substrate was expounded,the modification methods of polyphenylene ether were summarizes,and the application of polyphenylene ether resin in high frequency circuit was discussed.
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基金资助
陕西省自然科学基础研究计划(2019JM-075)
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