Research progress on preparation methods and dielectric properties of high dielectric constant La2O3 materials

Expand
  • 1. College of Materials Science and Engineering, Lanzhou Jiaotong University, Lanzhou 730070;
    2. College of Chemical Engineering and Materials, Quanzhou Normal University, Quanzhou 362000;
    3. College of Materials Science and Engineering, Tianjin University, Tianjin 300350;
    4. College of New materials and Footwear and Clothing Engineering, Liming Vocational University, Quanzhou 362000

Received date: 2023-02-21

  Revised date: 2024-02-01

  Online published: 2024-06-18

Abstract

Among many high dielectric constant gate dielectric materials,La2O3 possesses the characteristics of large band gap and good thermal stability,and has the potential to replace the traditional SiO2 gate dielectric.In this paper,the preparation methods of La2O3 thin films were introduced,and the current approaches to improve the dielectric properties of La2O3 films were reviewed.In the end,the future development of La2O3 was prospected.

Cite this article

Wei Xiaoru, Chen Wenjie, Wang Feng, Zhu Shengli . Research progress on preparation methods and dielectric properties of high dielectric constant La2O3 materials[J]. New Chemical Materials, 2024 , 52(6) : 33 -37 . DOI: 10.19817/j.cnki.issn1006-3536.2024.06.022

References

[1] Chen R,Li Y C,Cai J M,et al.Atomic level deposition to extend Moore's law and beyond[J].International Journal of Extreme Manufacturing,2020,2(2):28-52.
[2] Nadimi E,Rahimi A,Masoumi S,et al.Band offset and leakage current in fluorine doped Si/HfO2/SiO2 gate stack of metal oxide semiconductor field effect transistors:an ab initio investigation[J].Thin Solid Films,2022,746:1-6.
[3] 李驰平,王波,宋雪梅,等.新一代栅介质材料——高K材料[J].材料导报,2006,20(2):17-20.
[4] Kosmani N F,Hamid F A,Razali M A.Effects of high-k dielectric materials on electrical performance of double gate and gate-all-around MOSFET[J].International Journal of Integrated Engineering,2020,12(2):81-88.
[5] Xu B H,Lomenzo P D,Kersch A,et al.Influence of Si-doping on 45 nm thick ferroelectric ZrO2 films[J].ACS Applied Electronic Materials,2022,4(7):3648-3654.
[6] Patil S R,Barhate V N,Patil V S,et al.The effect of post-de-position annealing on the chemical,structural and electrical properties of Al/ZrO2/La2O3/ZrO2/Al high-k nanolamina-ted MIM capacitors[J].Journal of Materials Science-Materials in Electronics,2022,33(14):11227-11235.
[7] Liu L N,Tang W M,Lai P T.Advances in La-based high-k dielectrics for MOS applications[J].Coatings,2019,9(4):217.
[8] Palumbo F,Wen C,Lombardo S,et al.A review on dielectric breakdown in thin dielectrics:silicon dioxide,high-k,and layered dielectrics[J].Advanced Functional Materials,2020,30(18):1900657.
[9] Mah S K,Ahmad I,Ker P J,et al.High-k dielectric thickness and halo implant on threshold voltage control[J].Journal of Telecommunication,Electronic and Computer Engineering (JTEC),2018,10(2/3/4/5/6):1-5.
[10] Zhao L,Liu H,Wang X,et al.Band alignments of O3-based and H2O-based amorphous LaAlO3 films on silicon by atomic layer deposition[J].Journal of Materials Science:Materials in Electronics Volume,2017,28(1):803-807.
[11] Wu Y H,Yang M Y,Chin A,et al.Electrical characteristics of high quality La2O3 gate dielectric with equivalent oxide thickness of 5#xC5;[J].IEEE Electron Device Lett,2000,21:341-343.
[12] 汪星.原子层淀积La基高k介质材料的性能研究与应用特性研究[D].西安:西安电子科技大学,2017.
[13] George S M.Atomic layer deposition:an overview[J].Chemical Reviews,2010,110(1):111-131.
[14] Fan J B,Liu H X,Duan L,et al.Influences of different oxidants on characteristics of La2O3/Al2O3 nanolaminates deposited by atomic layer deposition[J].Chinese Physics B,2017,26(6):395-400.
[15] Zhao Y,Kita K,Kyuno K,et al.Band gap enhancement and electrical properties of La2O3 films doped with Y2O3 as high-k gate insulators[J].Applied Physics Letters,2009,94(4):42901.
[16] Kim W H,Maeng W,Moon K J,et al.Growth characteristics and electrical properties of La2O3 gate oxides grown by thermal and plasma-enhanced atomic layer deposition[J].Thin Solid Films,2010,519(1):362-366.
[17] 倪金玉,何慧凯,赵毅,等.化学气相沉积技术在先进CMOS集成电路制造中的应用与发展[J].智能物联技术,2022,5(1):1-7.
[18] Jun J H,Choi D J,Kim K H,et al.Effect of structural properties on electrical properties of lanthanum oxide thin film as a gate dielectric[J].Japanese Journal of Applied Physics,2003,42:3519-3522.
[19] Huang Y L,Liu H J,Ma C H,et al.Pulsed laser deposition of complex oxide heteroepitaxy[J].Chinese Journal of Physics,2019,60:481-501.
[20] 高宝龙,买买提热夏提·买买提,亚森江·吾甫尔,等.原位XPS分析Al2O3作为势垒层的Er2O3/Si结构[J].半导体技术,2017,42(5):394-399.
[21] Zhang X,Tu H,Zhao H,et al.Band structure and electronic characteristics of cubic La2O3 gate dielectrics epitaxially grown on InP substrates[J].Applied Physics Letters,2011,99(13):132902.
[22] Wong Y H,Cheong K Y.ZrO2 thin films on Si substrate[J].Journal of Materials Science:Materials in Electronics,2010,21(10):980-993.
[23] Sen B,Wong H,Molina J,et al.Trapping characteristics of lanthanum oxide gate dielectric film explored from temperature dependent current-voltage and capacitance-voltage mea-surements[J].Solid-State Electronics,2007,51(3):475-480.
[24] Lamagna L,Wiemer C,Perego M,et al.O3-based atomic layer deposition of hexagonal La2O3 films on Si (100) and Ge (100) substrates[J].Journal of Applied Physics,2010,108(8):84108.
[25] Stoyanovskii V O,Vedyagin A A.Size effects on the formation of LaAlO3 phase in La-doped β-Al2O3 after hydrothermal treatment[J].Ceramics International,2022,48(12):17449-17459.
[26] Choi J W,Min Y S,Kim K C.Mechanistic mapping of ozone-dosed Al2O3 atomic layer deposition half-cycles[J].Industrial & Engineering Chemistry Research,2022,61(27):9695-9702.
[27] Zhao Y,Kita K,Kyuno K,et al.Suppression of leakage current and moisture absorption of La2O3 films with ultraviolet ozone post treatment[J].Japanese Journal of Applied Physics,2007,46:4189-4192.
[28] 何美林,徐静平,陈建雄,等.LaON/SiO2和HfON/SiO2双隧穿层MONOS存储器存储特性的比较[J].物理学报,2013,62(23):432-438.
[29] Sato S,Tachi K,Kakushima K,et al.Thermal-stability improvement of LaON thin film formed using nitrogen radicals[J].Microelectronic Engineering,2007,84(9/10):1894-1897.
[30] Yamada H,Shimizu T,Kurokawa A,et al.MOCVD of high-dielectric-constant lanthanum oxide thin films[J].Journal of the Electrochemical Society,2003,150(8):429-435.
[31] Suzuki M.Comprehensive study of lanthanum aluminate high-dielectric-constant gate oxides for advanced CMOS devices[J].Materials,2012,5(3):443-477.
[32] McDaniel M D,Ngo T Q,Hu S,et al.Atomic layer deposition of perovskite oxides and their epitaxial integration with Si,Ge,and other semiconductors[J].Applied Physics Reviews,2015,2(4):41301.
[33] Sugumaran S,Divya T A,Sivaraman R K,et al.Structure,morphology and Ⅰ-Ⅴ characteristics of thermally evaporated LaAlO3 nanostructured thin films[J].Journal of Materials Science-Materials in Electronics,2022,33(12):9085-9100.
[34] Li S,Lin Y,Tang S,et al.A review of rare-earth oxide films as high k dielectrics in MOS devices——commemorating the 100th anniversary of the birth of academician Guangxian Xu[J].Journal of Rare Earths,2021,39(2):121-128.
[35] Fei C X,Liu H X,Wang X,et al.Influences of rapid thermal annealing on the characteristics of Al2O3/La2O3/Si and La2O3/Al2O3/Si films deposited by atomic layer deposition[J].Journal of Materials Science:Materials in Electronics,2016,27(8):8550-8558.
[36] Lee W J,Ma J W,Bae J M,et al.The diffusion of silicon atoms in stack structures of La2O3 and Al2O3[J].Current Applied Physics,2013,13(4):633-639.
Options
Outlines

/