Analysis on worldwide and China's supply and demand of epoxy molding compound

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  • 1. China National Chemical Economic and Technical Development Centre,Beijing 100723;
    2. School of Chemical Engineering,Beijing Institute of Petrochemical Technology,Beijing 102617

Received date: 2020-08-24

  Revised date: 2021-09-07

  Online published: 2021-12-31

Abstract

Epoxy molding compound (EMC) is the main material used in packaging semiconductor products.The production technology for EMC material was briefly introduced,and reviewed worldwide main EMC producers,supply/demand status and projection.From the aspects of production,import and export,consumption as well as balance between supply and demand,China's status and future trend of EMC were analyzed and expected.In addition,corresponding suggestions were given for China's EMC industry.

Cite this article

Cheng Lihong, Zhong Weike, He Xiaonan . Analysis on worldwide and China's supply and demand of epoxy molding compound[J]. New Chemical Materials, 2021 , 49(12) : 37 -39 . DOI: 10.19817/j.cnki.issn 1006-3536.2021.12.008

References

[1] 陈昭.环氧模塑料(EMC),E-mail:的设计和性能[J].电子工业专用设备,2010,181(2):43-49.
[2] 王龙兴.2019年中国集成电路封装测试业的状况[J].集成电路应用,2020,37(4):1-3.
[3] 安徽省安庆市生态环境局.安徽晶凯电子材料有限公司集成电路电子封装材料基地(安庆)项目(一期)环境影响报告书[EB/OL].[2018-01-19].http://aqxxgk.anqing.gov.cn/show.php?id=592195.
[4] 中国半导体行业协会封装分会.国半导体封装关键材料产业调研报告[EB/OL].[2018-12-17].http://www.chipmanufacturing.org/h-nd-596.html.
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