2021 , Vol. 49 >Issue 12: 37 - 39
DOI: https://doi.org/10.19817/j.cnki.issn 1006-3536.2021.12.008
Analysis on worldwide and China's supply and demand of epoxy molding compound
Received date: 2020-08-24
Revised date: 2021-09-07
Online published: 2021-12-31
Key words: epoxy molding compound; semiconductor; packaging
Cheng Lihong, Zhong Weike, He Xiaonan . Analysis on worldwide and China's supply and demand of epoxy molding compound[J]. New Chemical Materials, 2021 , 49(12) : 37 -39 . DOI: 10.19817/j.cnki.issn 1006-3536.2021.12.008
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