The degradation properties and mechanism of para aramid under the condition of high temperature were characterization of thermal degradation temperature,molecular structure and mechanical properties with the help of thermogravimetric analyzer,infrared spectrometer,X-ray diffractometer,ubbelohde viscometer,universal material testing machine and so on.The results showed that the molecular structure,thermal and mechanical properties of the para-aramid fiber remained relatively stable when the temperature was below 350℃.When the temperature was above 350℃,the molecular structure of the fiber cracked and crosslinked gradually,while the thermal and mechanical properties of the fiber decreased with the increasing of temperature.When the temperature was above 450℃,the crystallinity and orientation of the fiber decrease to a certain extent,and the intrinsic viscosity and apparent grain size of crystal surfaces increased to varying degrees with the increasing of temperature.The thermal degradation accorded with the second-order reaction kinetics.
Yang Chen, Lin Yanping, Wang Chenlu, Wang Jingxin
. Property characterization and mechanism of thermal degradation of para-aramid fiber[J]. New Chemical Materials, 2021
, 49(10)
: 109
-113
.
DOI: 10.19817/j.cnki.issn 1006-3536.2021.10.023
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