A solid-state bonding method based on Cu Ni secondary sea cucumber like micro nano layer was proposed.The surfaces of the two substrates with a sea cucumber like Cu Ni micro-nano layer were contacted with each other to form a contact area,and then pressure was applied to the contact area under heating conditions to bond.The sea cucumber like Cu Ni micro-nano layer included a copper needle layer and a nickel needle layer plated on the surface of the copper needle layer.The copper needle layer was an array layer formed by a tapered copper microneedle,and the nickel needle layer included an array layer formed by a tapered nickel nanoneedle and a protuberance.The microstructure,bonding mechanism and shear strength of the interface were analyzed by scanning electron microscope,transmission electron microscope and welding strength testing instrument.The results shown that this solid state bonding method can obtain high strength interconnection force.
Xiao Jin, Zhai Qian, Zhang Bin, Chen Weiquan
. Solid state bonding method based on Cu-Ni secondary sea cucumber like micro-nano layer[J]. New Chemical Materials, 2021
, 49(7)
: 221
-224
.
DOI: 10.19817/j.cnki.issn 1006-3536.2021.07.049
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