Interfacial bonding properties of A171/GO co-modified UHMWPE fiber-embedded NBR damping film composites

Wang Fengquan, Liang Sen, Tian Cheng, Liu Long, Guo Jian

New Chemical Materials ›› 2024, Vol. 52 ›› Issue (5) : 167-171.

New Chemical Materials ›› 2024, Vol. 52 ›› Issue (5) : 167-171. DOI: 10.19817/j.cnki.issn1006-3536.2024.05.011

Interfacial bonding properties of A171/GO co-modified UHMWPE fiber-embedded NBR damping film composites

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 52(5): 167-171 https://doi.org/10.19817/j.cnki.issn1006-3536.2024.05.011

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}

Accesses

Citation

Detail
Sections
Recommended
京ICP备09035943号-38
Copyright © New Chemical Materials, All Rights Reserved.
Tel: 010-64437113　E-mail: hgxx@cncic.cn
Powered by Beijing Magtech Co., Ltd.

/

〈 〉