Preparation and interfacial bonding mechanism of co-curing composite with embedded HXNBR damping film

Wu Zhaoqi, Liang Sen, Liu Long

New Chemical Materials ›› 2023, Vol. 51 ›› Issue (7) : 176-182.

New Chemical Materials ›› 2023, Vol. 51 ›› Issue (7) : 176-182. DOI: 10.19817/j.cnki.issn1006-3536.2023.07.032

Preparation and interfacial bonding mechanism of co-curing composite with embedded HXNBR damping film

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 51(7): 176-182 https://doi.org/10.19817/j.cnki.issn1006-3536.2023.07.032

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