贴补是复合材料修补中一种重要的修补方式,研究了贴补的补片直径和补片厚度对树脂基复合材料层压板弯曲强度恢复值的影响,确定了最佳的贴补工艺参数。并通过有限元分析建立了修补模型,对贴补工艺参数进行了优化。
Patch bonder repair is one of the most important composite material repair methods.How the patch diameter and ply of patch bonder repair effected the bending strength of resin-based composite laminate was studied,then the optimum technical parameters of patch bonder repair were obtained.The repair simulation mold was established by finite element analysis,and the technical parameters of patch bonder repair were optimized by the repair simulation mold.
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基金资助
四川省应用基础研究项目(19YJ0664)
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