以正硅酸四乙酯(TEOS)为硅源,4,4′-(六氟异丙烯)二酸酐(6FDA)为二酐单体,4,4′-二氨基二苯醚(ODA)为二胺单体,采用无水溶胶-凝胶法制备聚酰亚胺(PI)/二氧化硅(SiO2)杂化薄膜(PI-SiO2)。将3-氨基丙基三甲氧基硅烷(APS)通过化学键合连接到PI分子链上,使SiO2颗粒在PI基体中均匀分散。研究了PI-SiO2杂化薄膜的光学性能和热学性能。随着SiO2含量的增加,PI-SiO2杂化薄膜的黄色指数明显降低。在SiO2添加量为40%(wt,质量分数)条件下,制得的PI-SiO2的玻璃化转变温度最高为314.7℃,热膨胀系数(CTE)为27.65×10-6/℃,具有较好的热性能。
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