植物纤维无纺布表面化学镀镍及其机理研究

王辉1, 周守发1, 许丽丽1, 孙志平3, 黄俊俊1,2*

化工新型材料 ›› 2018, Vol. 46 ›› Issue (8) : 170 -173.

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化工新型材料 ›› 2018, Vol. 46 ›› Issue (8) : 170-173.
科学研究

植物纤维无纺布表面化学镀镍及其机理研究

    王辉1, 周守发1, 许丽丽1, 孙志平3, 黄俊俊1,2*
作者信息 +

Study on the preparation and mechanism of nickel plating on plant fiber nonwoven substrate

  • Wang Hui1, Zhou Shoufa1, Xu lili1, Sun Zhiping3, Huang Junjun1,2
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摘要

采用钯离子(Pd2+)活化结合化学镀镍工艺制备金属化的植物纤维无纺布,并对制得的植物纤维无纺布进行了测试,研究了植物纤维无纺布表面化学镀镍机理及植物纤维无纺布电磁屏蔽性能。结果表明,植物纤维无纺布表面含有大量氨基,能与Pd2+发生鳌合,使Pd2+能以化学吸附的形式固定在纤维的表面,形成催化中心,有利于金属沉积,化学镀后镍的沉积量为无纺布质量的33%(wt,质量分数),镀层晶型为面心立方,电磁屏蔽效能在1~16GHz的频率范围介于37.3~38.0dB之间。表明Pd2+活化结合化学镀工艺可以在植物纤维无纺布表面制备紧密、均匀、连续的金属镍层。

Abstract

The metalization of plant fiber nonwoven were prepared by Pd2+ activating and then electroless nickel plating.The mechanism of electroless plating,and the electromagnetic interference (EMI)-shielding effectiveness (SE) properties of plated sheet were investigated using thermogravimetry,X-ray diffraction electron microscopy,scanning electron microscopy and X-ray photoelectron spectroscopy.Results showed that the surface of nonwoven contained amine groups,which was more prone to absorb palladium catalyst to form an active layer for electroless nickel plating.The weigh change of non-woven after electroless nickel plating was 33wt%,the crystallographic structure of Ni-plated sheets was face centered cubic,and the average EMI-SE of nickel-plated sheets maintained a relatively stable value (37.3dB to 38.0dB) in a frequency range of 1 GHz to 16 GHz.It was indicated that the activated nonwoven were more prone to the plate of compact nickel coating.

关键词

非织造布 / 化学镀 / 电磁屏蔽 / 纤维

Key words

nonwoven / electroless plating / electromagnetic shielding / plant fiber

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植物纤维无纺布表面化学镀镍及其机理研究[J]. 化工新型材料, 2018, 46(8): 170-173 DOI:

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参考文献

[1] 甘雪萍.电磁屏蔽用导电涤纶织物制备新技术及其产业化应用研究[D].上海:上海交通大学,2007.
[2] Li F,Zhang D J,Li B H,et al.A new chemical platin system for hexagonal boron nitride particles[J].The Chinese Journal of Process Engineering,2002,5(2):425-430.
[3] Geng Y M,Lu C H,Liang M,et al.Characterization and properties of electroless nickel plated poly (ethylene terephthalate) nonwoven fabric enhanced by dielectric barrier discharge plasma pretreatment[J].Plasma Science and Technology,2010,12(6):715-721.
[4] Li C L,Zhang P,Jiang Z Y.Effect of nano Cu coating on porous Si prepared by acid etching Al-Si alloy powder[J].Electrochimica Acta,2015,161(10):408-412.
[5] Sun Z P,Huang J J,Wang L B,et al.Method for electroless nickel plating on poly(ethyleneterephthalate) substrate modified with primerand self-assembled monolayer[J].Journal of Materials Science:Materials in Electronics,2015,26(12):10132-10137.
[6] Wang J,Sun J J,Hu C G.Facile synthesis of flexible gold film electrodes for highly selective photoelectrochemical sensing of ascorbic acid[J].Journal of Electroanalytical Chemistry,2015,759(6):2-7.
[7] 雷敏志,陈森凤.钯膜与钯膜反应器应用研究进展[J].材料导报,2004,18(5):41-44.
[8] 胡正西,揭晓华,卢国辉.碳纳米管/铅锡新型复合减摩镀层的抗咬合行为[J].中南大学学报(自然科学版),2010,41(2):472-475.
[9] Lin X T,Wang P F,Li P,et al.Improved the lithium storage capability of BaLi2Ti6O14 by electroless silver coating[J].Electrochimica Acta,2015,186(8):24-33.
[10] Aaboubi O,Omar A Y A,Franczak F,et al.Investigation of the electrodeposition kinetics of Ni-Mo alloys in the presence of magnetic field[J].Journal of Electroanalytical Chemistry,2015,737(6):226-234.
[11] Chang Y,Tao Y,Zhang Q,et al.Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes[J].Electrochimica Acta,2015,158(8):7-12.
[12] 谢治辉,余刚.施镀时间对化学镀镍液阻抗谱及镀层表面形貌的影响[J].材料导报,2014,28(24):446-450.
[13] 田庆华.电沉积法制备金属锌泡沫材料[D].长沙:中南大学冶金科学与工程学院,2007.
[14] Hu X Q,He Q H,Zhang X B,et al.Fabrication of fluidic chips with 1-D nanochannels on PMMA substrates by photoresist-free UV-lithography and UV-assisted low-temperature bonding[J].Microfluid Nanofluid,2011,10(6):1223-1232.
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