采用非等温差示扫描量热法研究了双马来酰亚胺-三嗪树脂(BT树脂)及其改性氮化硼(BNOC)填充复合体系的固化过程,分析了不同升温速率下BNOC对树脂体系固化行为的影响,计算了固化体系的动力学参数。结果表明:BNOC的加入能显著降低BT树脂固化反应温度,加入15%(wt,质量分数)BNOC能使BT树脂固化峰值温度降低50℃以上;BT/BNOC复合体系的固化反应表观活化能平均值为58.53×103J/mol,比纯BT树脂体系表观活化能降低了24.5%;通过T-β外推法获得BT/BNOC复合体系的凝胶温度为390.84K、固化温度为429.57K、后处理温度为454.22K。
Curing process of bismaleimide-triazine(BT) resin and it's composite system filled with modified boron nitride (BNOC) was measured by non-isothermal differential scanning calorimetric method.The effect of BNOC on the curing behavior of BT resin at different scanning rates was analyzed.The kinetics parameters of curing systems were calculated.The results showed that the curing temperatures of BT resin decreased markedly with addition of BNOC.The curing peak temperature of resin containing 15wt% of BNOC was reduced by more 50℃ in comparison with the pure BT resin.The average value of activation energy of BT/BNOC was 58.53×103J/mol,which was decreased by 24.5% compared to that of pure BT resin.The gel temperature,curing temperature and after treat temperature of composite system obtained by T-β extrapolation method were 390.84K,429.57K and 454.22K,respectively.
[1] 刘辉,王耀先,程树军.双马来酰亚胺三嗪树脂改性研究进展[J].绝缘材料,2009,42(2):36-41.
[2] Bai L,Yan H,Yuan L,et al.Synthesis of functionalized GO for improving the dielectric properties of bismaleimide-triazine resin[J].Journal of Polymer Research,2016,23(8):169.
[3] Xia J,Li J,Zhang G,et al.Highly mechanical strength and thermally conductive bismaleimide-triazine composites reinforced by Al2O3@polyimide hybrid fiber[J].Composites Part A,2016,80:21-27.
[4] Lee D,Song S H,Hwang J,et al.Enhanced mechanical properties of epoxy nanocomposites by mixing noncovalently functionalized boron nitride nanoflakes[J].Small,2013,9(15):2602-2610.
[5] Zeng X,Yu S,Sun R.Thermal behavior and dielectric property analysis of boron nitride-filled bismaleimide-triazine resin composites[J].Journal of Applied Polymer Science,2013,128(3):1353-1359.
[6] Gao Y,Gu A,Jiao Y,et al.High-performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity,low coefficient of thermal expansion,and low dielectric loss[J].Polymers for Advanced Technologies,2012,23(5):919-928.
[7] 李想,李仙会,马颖琦.非等温DSC法研究环氧树脂/空心玻璃微珠体系固化动力学[J].理化检验-物理分册,2017,53(4):244-248.
[8] Leroy E,Du Puy J,Maazouz A.A method of estimating kinetie parameters of thermoset cures:application to a dieyanate ester resin[J].Macromolecular Chemistry & Physics,2001,202(4):465-474.
[9] Ozawa T.A new method of analyzing thermogravimetric data[J].Bull Chem Soc Jpn,1965,38(11):1881-1886.
[10] Crane L W,Dynes P J,Kaelble D H.Analysis of curing kinetics in polymer composites[J].Journal of Polymer Science,1973,11(8):533-540.
基金资助
江苏省高校自然科学研究面上项目(16KJB430034);江苏省“333工程”科研资助项目(BRA2017344);软化学与功能材料教育部重点实验室开放基金(30916014103);江苏省高校“青蓝工程”资助计划(2014)
PDF
(1363KB)
