为探究有机载体含量对紫外光固化导电胶性能的影响,用银包铜粉作为导电填料,环氧丙烯酸树脂作为基体树脂制得紫外光固化导电胶。采用1-羟基环己基苯基甲酮(Irgacure184)和二苯甲酮(BP)作为复合光引发体系实现导电胶的完全固化。借助四探针电阻测试仪、金相显微镜、SNB-1A-J型旋转式高温数显黏度计和电脑式剥离强度试验机对固化后的试样微观结构进行性能分析。结果表明,当有机载体由56%(wt,质量分数,下同)的环氧丙烯酸脂、8.25%的三羟甲基丙烷三丙烯酸酯(TMPTA)、24.75%的N-乙烯基吡咯烷酮(NVP)、2%的Irgacure184、2%的BP、3%的偶联剂KH550、3%的消泡剂和0.8%的流平剂组成,且有机载体在导电胶中的含量为30%时,导电胶黏度适中,印刷性能良好,力学性能优异,电阻率的最低值为1.122×10^-3Ω·cm。

With the aim of studying the effects of organic carrier on the properties of UV curable conductive adhesive,UV curable paste was prepared using silver coated copper powder as the conductive filler and epoxy acrylic resin as the matrix resin,respectively,which was cured completely using Irgacure184 and BP as complex photoinitiator.The cured paste was characterized by four probe resistance tester,optical microscope,SNB-1A-J type rotary high temperature digital viscometer,and computer stripping strength testing machine,respectively.The results showed that when the content of organic carrier was 30wt%,in which epoxy acrylic resin,TMPTA,NVP,Irgacure184,BP,coupling agent KH550,defoamer and flatting agent were 56%,8.25%,24.75%,2%,2%,3%,3% and 0.8%,respectively,the conductive paste presented the moderate viscosity,good mechanical property,and good printing performance.The resistivity reached the minimum value of 1.122×10^-3Ω·cm.