将双酚F型环氧树脂、联苯型环氧树脂和双酚A型酚醛环氧树脂混合得到双酚F型环氧树脂三元共混体系,通过差示扫描量热(DSC)法对三元共混体系的固化行为进行研究,以确定三元共混体系的固化动力学。在氮气气氛下以不同的升温速率(5℃/min、10℃/min、15℃/min和20℃/min)进行固化反应动力学实验,通过温度-升温速率外推法、Kissinger和Crane方程,得到双酚F型环氧树脂三元共混体系固化反应动力学参数(表观活化能为45.67kJ/mol、指前因子为1.08×105s-1、反应级数为0.86)。根据固化反应动力学参数,确定双酚F型环氧树脂三元共混体系固化温度为130～140℃,固化时间为120～150s。
A ternary bled system was prepared by mixing bisphenol F epoxy,biphenyl epoxy,and bisphenol A phenolic epoxy resins.The curing behavior of the ternary epoxy resin blend system was investigated through non-isothermal differential scanning calorimetry (DSC) to determine its curing kinetics.Non-isothermal curing studies were conducted at heating rates of 5-20℃/min (5℃ increments) under the nitrogen atmosphere.The kinetic parameters of the curing reaction were obtained from these test data by the T-β extrapolation method,Kissinger and Crane equation.The apparent activation energy was 45.67kJ/mol,the pre-exponential factor was 1.08×105s-1,and the reaction order was 0.86.Based on the curing reaction kinetic parameters,the curing temperature of the bisphenol F epoxy resin ternary blend system was determined to be 130-140℃,and the curing time was 120-150s.
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