将分子动力学模拟及其合成理论相结合,提出使用耐高温氟硅橡胶(FSR)作为功能相、双马来酰亚胺(BMI)树脂为基体相,在280℃发生共固化反应制备嵌入式高温共固化阻尼复合材料的思路。通过正交试验设计了符合高温共固化要求的FSR混炼胶组分,该组分中的分子官能团在硫化时能通过化学键自生长在BMI基体树脂上,实现了BMI树脂固化的同时FSR阻尼材料也在同步硫化,制备了新型嵌入式高温共固化FBR/BMI阻尼复合材料。通过傅里叶变换红外光谱仪、X射线光电子能谱仪对阻尼复合材料的化学结构及表面元素的化学价态进行了表征,并研究了复合材料的界面结合性能。结果表明:随着阻尼薄膜厚度的增加,复合材料的界面剪切力减小;当阻尼薄膜厚度为0.1mm时,阻尼复合材料的界面剪切力和界面剪切强度分别达到5050N和7.834MPa。
By combining molecular dynamics simulation and synthesis theory,a strategy was proposed to use high-temperature-resistant fluorosilicone rubber (FSR) as functional phase and bismaleimide resin (BMI) as matrix phase to prepare embedded high-temperature co-cured damping composites by co-curing reaction at 280℃.An FSR compound formulation suitable for high-temperature co-curing was designed through orthogonal experimental methods.The molecular functional groups in the FSR compound could self-grow on the BMI matrix resin by chemical bonds during vulcanization,and the new embedded high-temperature co-cured FBR/BMI damping composites were prepared by simultaneous curing of the BMI resin and synchronous vulcanization of the FSR damping material.The chemical structure and chemical valence states of the surface elements of the damping composites were characterized by FT-IR and XPS.The interfacial bonding properties of the composites were also studied.The results showed that the interfacial shear stress of the composites decreased with the increase of the thickness of the damping film.When the damping film thickness was 0.1mm,the interfacial shear stress and shear strength of the composites were 5050N and 7.834MPa,respectively.
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