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摘要
随着电子元件的集成化和小型化程度不断提高,运行过程中产生的热量持续增加,对设备的散热提出了更高要求。通过有机硅烷和氧化锌表面修饰AlN制备了高性能的导热复合材料。结果表明:表面修饰改善了AlN填料与有机硅的相容性,制备的有机硅导热复合材料在填充率为92%时,热导率达到5.49W/(m·K),热阻低至0.023℃/W,同时具有良好的绝缘性与极低的油离度。通过原位中央处理器(CPU)散热测试平台测试,改性后的有机硅导热复合材料显著降低了CPU的核心温度,确保了电子器件在大功率下的稳定运行,为电子设备的散热问题提供了新的解决方案。
Abstract
With the continuous improvement of the integration and miniaturization of electronic components,the heat generated during operation continues to increase,which puts forward higher requirements for the heat dissipation of equipment.High-performance thermally conductive composites were prepared by surface modification of AlN with organic silane and zinc oxide.The experimental results showed that the surface modification improved the compatibility between AlN filler and silicone.When the filling rate was 92wt%,the thermal conductivity of the prepared silicone thermal conductive composite reached 5.49W/(m·K),and the thermal resistance was as low as 0.023℃/W,along with excellent insulation properties and extremely low oil separation.Through the in-situ CPU heat dissipation test platform test,the modified silicone thermal conductive composite material significantly reduced the core temperature of the CPU,ensuring the stable operation of electronic devices under high power and providing a new solution for the heat dissipation problem of electronic devices.
关键词
热界面材料
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有机硅复合材料
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表面修饰
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热导率
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可靠性
Key words
thermal interface materials
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silicone composites
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surface modification
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thermal conductivity
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reliability
表面修饰氮化铝制备有机硅导热复合材料及在电子封装中的应用[J].
化工新型材料, 2025, 53(12): 130-135 DOI:10.19817/j.cnki.issn1006-3536.2025.12.034
[1] Zhao Y,Zeng X,Ren L,et al.Heat conduction of electrons and phonons in thermal interface materials[J].Materials Chemistry Frontiers,2021,5(15):5617-5638.
[2] Chen S,Deng Z,Liu J.High performance liquid metal thermal interface materials[J].Nanotechnology,2021,32(9):092001.
[3] Hansson J,Nilsson T M J,Ye L,et al.Novel nanostructured thermal interface materials:a review[J].International Materials Reviews,2018,63(1):22-45.
[4] Dai W,Ren X J,Yan Q,et al.Ultralow interfacial thermal resistance of graphene thermal interface materials with surface metal liquefaction[J].Nano-Micro Letters,2022,15(1):9.
[5] Dou Z,Zhang B,Xu P,et al.Dry-contact thermal interface material with the desired bond line thickness and ultralow applied thermal resistance[J].ACS Applied Materials & Interfaces,2023,15(49):57602-57612.
[6] Naghibi S,Kargar F,Wright D,et al.Noncuring graphene thermal interface materials for advanced electronics[J].Advanced Electronic Materials,2020,6(4):1901303.
[7] Wu S W,Chang T C,Lin Y H,et al.Fabrication of copper powder hybrid supported fillers with interconnected 1D/2D/3D nanostructures for enhanced thermal interface materials properties[J].The International Journal of Advanced Manufacturing Technology,2022,121(5):3453-3462.
[8] 许永伦,庞云嵩,任琳琳,等.高性能导热胶粘剂热界面材料:机理、现状与趋势[J].中国胶粘剂,2023,32(1):44-54.
[9] Younes H,Christensen G,Horton M,et al.TC study of manufacturable nano grease:evidence of 3D network Structure[J].Nanomanufacturing and Metrology,2018,1(3):148-155.
[10] 陈林玉,张向军,张鸣一,等.氮化铝纳米陶瓷粉末制备方法的研究进展[J].兵器材料科学与工程,2024,47(3):130-137.
