随着5G通讯技术的飞速发展,电子设备需要更高的信号传输速率以及更低的信号延迟,具有低介电常数与低介电损耗特征的介质材料在高频通讯组件中具有广阔的应用前景。综述了近年来国内外低介电有机硅材料的研究进展,总结了降低有机硅材料介电常数的主要方法:降低分子极化率和减少单位体积内极化分子的数量,并展望了未来低介电有机硅材料的发展方向。
With the rapid development of 5G communication technology,electronic devices need higher signal transmission rate and lower signal delay.Dielectric materials,with low dielectric constant and low dielectric loss characteristics,have broad application prospects in high-frequency communication components.The research progress of low dielectric silicone materials at home and abroad in recent years was reviewed,and the main methods to reduce the dielectric constant of silicone materials were summarized:lowering the molecular polarizability and reducing the number of polarized molecules per unit volume.The development directions of low dielectric silicone materials in future were also prospected.
[1] Li R,Yang X,Li J,et al.Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging[J].Materials Today Physics,2022,22:100594-100612.
[2] 谢高艺,马春平,全大萍,等.低介电聚合物材料研究进展[J].绝缘材料,2021,54(9):15-29.
[3] Islam Z,Fu Y Q,Deb H,et al.Polymer-based low dielectric constant and loss materials for high-speed communication network:dielectric constants and challenges[J].European Polymer Journal,2023,200:112543.
[4] Hou J R,Sun J,Fang Q.Recent advance in low-dielectric-constant organosilicon polymers[J].Chinese Journal of Chemistry,2023,41:2371-2381.
[5] 赵恩顺,唐安斌.低介电常数聚合物研究进展[J].化工新型材料,2007,35(7):11-14.
[6] Wang J J,Jin K K,Sun J,Fang Q.Dendrimeric organosiloxane with thermopolymerizable-OCFvCF2 groups as the arms:synthesis and transformation to the polymer with both ultra-low k and low water uptake[J].Polymer Chemistry,2016,7:3378-3382.
[7] Wang J J,Sun J,Zhou J F,et al.Fluorinated and thermo-cross-linked polyhedral oligomeric silsesquioxanes:new organic-inorganic hybrid materials for high-performance dielectric application[J].ACS Applied Materials & Interfaces,2017,9:12782-12790.
[8] Xin Y M,Wang J J,Jin K K,et al.A new four-arm organosiloxane with thermopolymerizable trifluorovinyl ether groups:synthesis and conversion to the polymer with both low dielectric constant and low water uptake[J].Macromolecular Chemistry and Physics,2017,218:1700010.
[9] Wang J J,Zhou J F,Jin K K,et al.A new fluorinated polysiloxane with good optical properties and low dielectric constant at high frequency based on easily available tetraethoxysilane (TEOS)[J].Macromolecules,2017,50:9394-9402.
[10] Yuan C,Wang J J,Jin K K,et al.Postpolymerization of functional organosiloxanes:an efficient strategy for preparation of low-k material with enhanced thermostability and mechanical properties[J].Macromolecules,2014,47:6311-6315.
[11] Chen X R,Sun J,Fang L X,et al.Cross-linkable fluorinated polynorbornene with high thermostability and low dielectric constant at high frequency[J].ACS Applied Polymer Materials,2020,2:768-774.
[12] Tao Y Q,Zhou J F,Fang L X,et al.Fluoro-containing polysiloxane thermoset with good thermostability and acid resistance based on the renewable multifunctional vanillin[J].ACS Sustainable Chemistry & Engineering,2019,7:7304-7311.
[13] Liu F P,Chen X R,Fang L X,et al.An effective strategy for the preparation of intrinsic low-k and ultralow-loss dielectric polysiloxanes at high frequency by introducing trifluoromethyl groups into the polymers[J].Polymer Chemistry,2020,11:6163-6170.
[14] Xie J Y,Zeng Y Z,Feng Y G,et al.Intrinsic low dielectric thermally crosslinked fluorinated polystyrene siloxanes at high frequency with good thermostability and optical properties[J].European Polymer Journal,2024,215:113227.
[15] Kotha S,Lahiri K,Tangella Y.Recent advances in benzocyclobutene chemistry[J].Asian Journal of Organic Chemistry,2021,10:3166-3185.
[16] Burdeaux D,Townsend P,Carr J,et al.Benzocyclobutene (BCB) dielectrics for the fabrication of high density,thin film multichip modules[J].Journal of Electronic Materials,1990,19:1357-1366.
[17] Zuo X B,Yu R L,Shi S,et al.Synthesis and characterization of photosensitive benzocyclobutene-functionalized siloxane thermosets[J].Journal of Polymer Science,2009,47:6246-6258.
[18] Huang Y W,Zhang Q L,Peng Q X,et al.Low-dielectric-constant benzocyclobutene-organosilicon resins constructed from cyclotetrasiloxane[J].Journal of Applied Polymer Science,2019,136:47465.
[19] Wei X L,Hu H,Li X,et al.Materials containing benzocyclobutene units with low dielectric constant and good thermostability prepared from star-shaped molecules[J].Journal of Applied Polymer Science,2019,136:47458.
[20] Hu X Y,Du H L,Peng J,et al.Low-dielectric-constant benzocyclobutene-based polysiloxane resins with excellent photoimaging properties[J].ACS Applied Polymer Materials,2024,6:2626-2636.
[21] Peng Q X,Hu H,Deng Y T,et al.Preparation and properties of benzocyclobutene based low-k linear polysiloxane[J].Journal of Materials Chemistry C,2022,10:9106-9113.
[22] Fan L,Zhang S B,Li X,et al.Room-temperature photopatternable low-dielectric cured resins derived from siloxane-carbosilane hybridized polymers[J].Journal of Materials Chemistry C,2019,7:1518-1524.
[23] Fan L,Peng Q X,Yuan W,et al.UV-curable low dielectric siloxane-benzocyclobutene resins via introducing carbosilane groups[J].European Polymer Journal,2021,161:110833.
[24] Fan L,Cao K,Hu H,et al.Low-dielectric silylbutylene-benzocyclobutene resin with photoactive silacyclobutane groups via acyclic diene metathesis polymerization[J].Polymers for Advanced Technologies,2022,33:2542-2551.
[25] Liu F P,Chen X R,Hou J R,et al.A fluorinated thermocrosslinkable organosiloxane:a new low-k material at high frequency with low water uptake[J].Macromolecular Rapid Communications,2021,42:2000600.
[26] Hou J R,Sun J,Fang Q.Oxygen-free polymers:new materials with low dielectric constant and ultra-low dielectric loss at high frequency[J].Polymer Chemistry,2023,14:3203-3212.
[27] Fan W J,Hong N M,Sun Q,et al.Thermo-curable and photo-patternable polysiloxanes and polycarbosiloxanes by a facile Piers-Rubinsztajn polycondensation and postmodification[J].Polymer Chemistry,2022,13:2187-2194.
[28] Kong L Q,Cheng Y R,Jin Y X,et al.Adamantyl-based benzocyclobutene low-k polymers with good physical properties and excellent planarity[J].Journal of Materials Chemistry C,2015,3:3364-3370.
[29] Zhou D L,Li J H,Guo Q Y,et al.Polyhedral oligomeric silsesquioxanes based ultralow-k materials:the effect of cage size[J].Advanced Functional Materials,2021,31:2102074.
[30] Hu H,Ma J J,Yuan W,et al.Flexible and low-k polymer featuring hard-soft-hybrid strategy[J].RSC Advances,2020,10:11898-11902.
[31] Fu F,Shen M G,Wang D,et al.A rosin-based dielectric polymer with intrinsic low dielectric constant and comprehensively excellent properties[J].Journal of Materials Chemistry C,2021,9:13144-13156.
[32] Mo J,Ma W,Qiu G,et al.Mesoporous silica coated graphene oxide:fabrication,characterization and effects on the dielectric properties of its organosilicon hybrid films[J].Journal of Materials Science:Materials in Electronics,2019,30:130-146.
[33] Feng Z,Liu X,Zhang W,et al.Functionalized mesoporous silica liquid crystal epoxy resin composite:an ideal low-dielectric hydrophobic material[J].Journal of Materials Science,2022,57:1156-1173.
[34] Mastalygina1 E E,Chukhlanov V Y.Dielectric study of syntactic foams based on polydimethylsiloxane and hollow glass microspheres at X-band microwave frequency[J].Materials Science and Engineering,2020,896:012101.
[35] 吴航.低介电高导热硅橡胶复合材料的制备及其阻燃性能研究[D].北京:中国科学技术大学,2022.
[36] 李晓飞.纳米结构颗粒对硅橡胶电气性能的影响研究[D].北京:中国科学院大学(中国科学院过程工程研究所),2019.
[37] Li M L,Sun Q,Fan W J,et al.A bis-stabilized interface strategy for low-k benzocyclobutene-based hollow silica nanocomposites[J].ACS Applied Polymer Materials,2023,5,3698-3706.
[38] 刘伟.氧化锌中空微球低介电高导热复合材料的制备与性能研究[D].广州:华南理工大学,2023.
[39] Tang W Y,Liao X,Shi S Z,et al.Significantly enhanced porosity of silicone rubber nanocomposite foams via cross-linking structure regulation and heterogeneous nucleation by CNTs for promising ultralow-k dielectrics[J].Industrial & Engineering Chemistry Research,2022,61:14251-14259.
PDF
