电子元器件中的热量集聚会导致热失效问题,同时器件产生的电磁辐射会干扰器件正常工作,降低器件使用寿命和影响人体健康。基于电子产品散热和电磁屏蔽的共同需求,重点阐述了导热、电磁屏蔽双功能碳纤维复合材料(CF/MXene)表面改性、结构设计等方面的研究,总结出开发该材料的关键突破点:构建三维网络、解决堆叠问题、增强界面效应;指出对应的优化手段,包括探索多种制备工艺、调控薄膜材料微观结构、优化材料内部界面性能及拓展研究多种MXene材料。研究该材料对于解决电子信息时代科技发展的桎梏具有重要意义。
The heat concentration in electronic components can lead to thermal failure problems,while the electromagnetic radiation generated by the devices can interfere with the normal operation of the devices,reduce the service life of the device and affect human health.Based on the common requirements of heat dissipation and electromagnetic shielding of electronic products,this paper focused on the surface modification and structural design of heat-conducting/electromagnetic shielding dual-functional CF/MXene composites,and summarized the key breakthrough points in the development and preparation of heat-conducting/electromagnetic shielding dual-functional CF/MXene composites:constructing three-dimensional network,solving stacking problem and enhancing interface effect.The corresponding optimization means were pointed out,including exploring a variety of preparation processes,regulating the microstructure of thin film materials,optimizing the internal interface properties of materials and expanding and researching a variety of MXene materials.The study holds significant importance for overcoming the challenges of scientific and technological progress in the electronic information era.
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基金资助
浙江省自然科学基金项目(LQ24E030015);中国博士后科学基金项目(2023M733598)
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