随着电子设备的高集成度和小型化,电子芯片的散热引起人们越来越多的关注,高潜热的相变薄膜应运而生。以聚乳酸(PLA)为支撑材料,五种不同分子量的聚乙二醇(PEG)为相变材料,二氯甲烷(DCM)为溶剂,采用溶液共混法制备PEG/PLA复合材料,倒置在玻璃皿上流延制备新型柔性相变薄膜(PCF)。对薄膜进行化学结构分析,结果表明,PLA和PEG之间没有形成新的化学键,两者通过分子间作用力结合。所制备的膜还具有较大的潜热(>96.08J/g)、出色的循环和形状稳定性(50次循环)、在超过100℃温度下也无泄漏并保持优异的可降解功能。进一步增强了其在28.32～61.59℃温度下的安全性,以及在长期应用的电子产品中的热管理适用性。
With the high integration and miniaturization of electronic equipment,the heat dissipation of electronic chips has attracted more and more attention,and phase change films with high latent heat have emerged.Using poly (lactic acid) (PLA) as the supporting material,five kinds of polyethylene glycol (PEG) with different molecular weights as the phase change materials,and dichloromethane (DCM) as solvent,PEG/PLA composites were prepared by solution blending method,and a new flexible phase change film (PCF) was prepared by inverted casting on a glass dish.The chemical structure of the film was analyzed,and the results showed that there was no new chemical bond between polylactic acid and polyethylene glycol,and they were combined by intermolecular force.The prepared film also had large latent heat (>96.08J/g),excellent cycle and shape stability (50 cycles),no leakage even at over 100℃,while maintaining outstanding degradability.It further enhanced the thermal management applicability in electronic products and safety at temperatures ranging from 28.32 to 61.59℃ for long-term applications.
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基金资助
河南省中原科技创新领军人才项目(234200510011);河南省重点研发计划(241111320900,231111320900);郑州市协同创新专项(校重大重点项目培育)(2021ZDPY0107)
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