以聚酰亚胺(PI)为基体,羟基化六方氮化硼(OBN)和聚多巴胺包覆碳化硅(PDA@SiC)为导热填料,通过原位聚合法制备了具有良好导热性能的聚酰亚胺/氮化硼/碳化硅(PI/OBN/PDA@SiC)复合材料,采用X射线衍射仪、扫描电子显微镜、X射线光电子能谱仪、热重分析仪等对填料和复合材料的结构、微观形貌、化学组成及热稳定性能进行表征和分析,研究了填料含量对聚酰亚胺复合材料性能的影响。结果表明,改性填料总质量分数为50%的PI/OBN/PDA@SiC-50复合材料导热性能显著增强,与添加未改性填料的复合材料相比,导热系数从0.43W/(m·K)提高到0.61W/(m·K)。同时,PI/OBN/PDA@SiC-50复合材料具有优异的绝缘性能,体积电阻率为2.37×1016Ω·cm。
Polyimide/boron nitride/silicon carbide (PI/OBN/PDA@SiC) composites with good thermal conductivity were prepared by in-situ polymerization using polyimide (PI) as the matrix and hydroxylated hexagonal boron nitride (OBN) and polydopamine-coated silicon carbide (PDA@SiC) as the thermally conductive fillers.X-ray diffractometer,scanning electron microscope,X-ray photoelectron spectrometer and thermogravimetric analyzer were used to characterize and analyze the structure,microscopic morphology,chemical composition and thermal stability of the composites,and the effect of filler content on the properties of polyimide composites was investigated.The results showed that the thermal conductivity of PI/OBN/PDA@SiC-50 composites with a total mass fraction of 50% modified fillers was significantly enhanced,which increased from 0.43W/(m·K) to 0.61W/(m·K) compared with that of the composites with unmodified fillers.Meanwhile,the PI/OBN/PDA@SiC-50 composites had excellent insulating properties with a volume resistivity of 2.37×1016Ω·cm.
[1] Kim W.Strategies for engineering phonon transport in thermoelectrics[J].Journal of Materials Chemistry C,2015,3(40):10336-10348.
[2] Mehra N,Mu L,Ji T,et al.Thermal transport in polymeric materials and across composite interfaces[J].Applied Materials Today,2018,12:92-130.
[3] Ruan K,Shi X,Guo Y,et al.Interfacial thermal resistance in thermally conductive polymer composites:a review[J].Composites Communications,2020,22:100518.
[4] Hao F,Wang J,Qi S,et al.Structures and properties of polyimide with different pre-imidization degrees[J].Chinese Journal of Polymer Science,2020,38:840-846.
[5] Ogbonna V E,Popoola A P I,Popoola O M,et al.A review on polyimide reinforced nanocomposites for mechanical,thermal,and electrical insulation application:challenges and recommendations for future improvement[J].Polymer Bulletin,2020,79:663-695.
[6] Liu B,Zhou Y,Dong L,et al.Enhanced thermal conductivity in copolymerized polyimide[J].iScience,2022,25(11):105451.
[7] Ruan K,Guo Y,Gu J.Liquid crystalline polyimide films with high intrinsic thermal conductivities and robust toughness[J].Macromolecules,2021,54(10):4934-4944.
[8] 李沐坤,郭永强,阮坤鹏,等.聚酰亚胺导热材料的制备研究进展[J].高分子通报,2023,36(8):979-997.
[9] Guo Y,Ruan K,Shi X,et al.Factors affecting thermal conductivities of the polymers and polymer composites:a review[J].Composites Science and Technology,2020,193:108134.
[10] Wang X,Niu X,Kang W,et al.Enhanced effective thermal conductivity of composite materials by incorporating constructal fillers[J].International Journal of Thermophysics,2021,42(7):106.
[11] 王海涛,丁栋梁,刘乾,等.聚酰亚胺基导热复合材料研究进展[J].高分子材料科学与工程,2019,35(8):159-166.
[12] Yang X,Liang C,Ma T,et al.A review on thermally conductive polymeric composites:classification,measurement,model and equations,mechanism and fabrication methods[J].Advanced Composites and Hybrid Materials,2018,1(2):207-230.
[13] 王晓龙,王李波,连维维,等.AlN-CNTs/聚酰亚胺复合材料的制备与性能[J].化工新型材料,2020,48(3):64-68;74.
[14] 高梦岩,王畅鸥,贾妍,等.导热聚酰亚胺绝缘薄膜材料的研究进展[J].绝缘材料,2021,54(6):1-9.
[15] Duan G,Wang Y,Yu J,et al.Novel poly(m-phenyleneisophthalamide) dielectric composites with enhanced thermal conductivity and breakdown strength utilizing functionalized boron nitride nanosheets[J].Macromolecular Materials and Engineering,2019,304(11):1900310.
[16] Muratov D S,Kuznetsov D V,Il'inykh I A,et al.Thermal conductivity of polypropylene composites filled with silane-modified hexagonal BN[J].Composites Science and Technology,2015,111:40-43.
[17] Tong Y,Zhao W,Wu W,et al.Realizing enhanced dielectric and mechanical performance of polyvinylidene fluoride/SiC nanocomposites through a bio-inspired interface design[J].Advanced Composites and Hybrid Materials,2021,5(1):263-277.
[18] Ou X,Lu X,Chen S,et al.Thermal conductive hybrid polyimide with ultrahigh heat resistance,excellent mechanical pro-perties and low coefficient of thermal expansion[J].European Polymer Journal,2020,122:109368.
[19] Tsai M,Tseng I,Chiang J,et al.Flexible polyimide films hybrid with functionalized boron nitride and graphene oxide si-multaneously to improve thermal conduction and dimensional stability[J].ACS Applied Materials & Interfaces,2014,6(11):8639-8645.
PDF
