基于多巴胺优异的表面包覆能力制备了聚多巴胺(PDA)改性氮化碳纳米片(CNNS),再通过化学还原法制备了具有优异界面相容性的银修饰氮化碳纳米片(Ag@CNNS)。将Ag@CNNS填充进聚酰亚胺(PI)基体中制备了PI复合材料,考察填料Ag@CNNS的含量对复合材料热稳定性、导热性能、力学性能和电绝缘性能的影响。结果表明,添加Ag@CNNS的复合材料表现出了良好的热稳定性;随着Ag@CNNS含量的不断提高,PI复合材料的导热系数随之提高,在Ag@CNNS质量分数为20%时,达到0.503W/(m·K)。同时,PI复合材料还保持了良好的力学性能和优异的绝缘性能,其体积电阻率达到了1012Ω·cm,拉伸强度保持在80M～105MPa之间。体现出了PI复合材料在电子封装领域作为热管理材料的潜质。
Polydopamine (PDA)-modified carbon nitride nanosheets (CNNS) were prepared based on the outstanding surface coating ability of dopamine,and then silver-modified carbon nitride nanosheets (Ag@CNNS) with excellent interfacial compatibility were synthesized by chemical reduction method.Polyimide composites were prepared by filling Ag@CNNS into polyimide (PI) matrix.The effects of filling Ag@CNNS content on the thermal stability,thermal conductivity,mechanical properties and electrical insulation properties of the composites were investigated.The results showed that the composites with Ag@CNNS had good thermal stability.With the continuous increase of Ag@CNNS content,the thermal conductivity of PI composite increased,reaching 0.503W·m-1·K-1 when Ag@CNNS content was 20wt%.At the same time,the PI composite also maintained good mechanical properties and excellent insulation properties,with a volume resistivity reaching 1012Ω·cm and a tensile strength remaining between 80M～105MPa,demonstrating the potential of polyimide composites as thermal management materials in the field of electronic packaging.
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