化工新型材料

化工新型材料 ›› 2023, Vol. 51 ›› Issue (5) : 92-96. DOI: 10.19817/j.cnki.issn1006-3536.2023.05.016

新材料与新技术

低介电聚倍半硅氧烷/聚酰亚胺共聚膜的制备与性能表征

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Preparation and characterization of low dielectric polysiloxane/polyimide copolymer films

Lv Xiuwei, Yv Juan, Wang Xiaodong, Huang Pei

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Received		Published
2021-12-14		2023-05-20
Issue Date	Revised Date
2023-05-31	2021-12-14

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摘要

通过水解缩合法制备末端为氨基的多面体低聚倍半硅氧烷(NH₂-POSS),并以此多面体低聚倍半硅氧烷(NH₂-POSS)作为聚酰亚胺的“二胺”,混合4,4′-二氨基二苯醚(ODA),均苯四甲酸二酐(PMDA)为二酐,以原位聚合法制备二元共聚聚酰胺酸溶液(PAA)。以二分法确定了NH₂-POSS在共聚PAA溶液中提供的氨基比例,通过热亚胺化制备成膜。探究了不同比例下NH₂-POSS对共聚膜的性能影响,通过红外光谱、热重分析仪、万能试验机和宽频介电阻抗谱仪对共聚膜进行性能表征。结果表明:共聚膜具有媲美纯聚酰亚胺膜的热稳定性(545℃,5%)和力学性能(拉伸强度90～122MPa),并且具有更低的介电常数(25% POSS-PI膜,10⁶Hz介电常数2.8)。

Abstract

Polyhedral oligomer polysiloxane (NH₂-POSS) with amino terminal was prepared by hydrolytic condensation,and the NH₂-POSS was used as the “diamine” of polyimide,mixed with 4,4′-diaminodiphenyl ether (ODA) and pyromellitic dianhydride (PMDA) to obtain binary copolymerized polyamide acid (PAA) solution was by in-situ polymerization.The amino ratio of NH₂-POSS in the copolymerized PAA solution was determined by the dichotomy method,and the film was prepared by thermal imidization.The effects of NH₂-POSS on the properties of copolymer films in different proportions were explored.The properties of copolymer films were characterized by infrared spectroscopy,thermogravimetric analyzer,universal testing machine and broadband dielectric impedance spectrometer.The results showed that the copolymer film had comparable thermal stability (545℃,5wt%) and mechanical properties (tensile strength 90～122MPa) to pure polyimide film,and had a lower dielectric constant (25% POSS-PI film,10⁶Hz dielectric constant 2.8).

关键词

低介电材料 / 聚倍半硅氧烷 / 聚酰亚胺 / 共聚

Key words

low dielectric materials / polysiloxane / polyimide / copolymerization

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低介电聚倍半硅氧烷/聚酰亚胺共聚膜的制备与性能表征[J]. 化工新型材料, 2023, 51(5): 92-96 DOI:10.19817/j.cnki.issn1006-3536.2023.05.016

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