采用直流磁控溅射镀膜技术以304不锈钢为基体在不同基底负偏压(0、100V、150V、200V和250V)下制备掺杂铜的纳米结构类金刚石薄膜(Cu-DLC)。利用能谱分析仪和X射线衍射分析仪分析薄膜成分和物相结构。采用球盘旋转式摩擦磨损试验机考察薄膜的摩擦学性能,再以三维超景深显微镜对磨痕的形貌进行分析。结果表明:在304不锈钢基底上成功制备了一系列Cu-DLC薄膜,无负偏压时,薄膜掺铜量较低,摩擦学性能较差;加负偏压后,薄膜掺铜量升高,但随着负偏压的增大,掺铜量逐渐减少;Cu元素的掺杂可有效地降低薄膜的摩擦系数,所制备的薄膜均有较低的摩擦系数,均在0.1以下,实现了低摩擦;基底负偏压影响薄膜的元素掺杂量及薄膜摩擦学性能,负偏压为100V时,薄膜的掺铜量最高,薄膜的摩擦学性能最优,此时摩擦系数为0.0669,磨损率最小,为9.87×10-5mm3/(N·m)。
Copper-doped nanostructured diamond-like carbon film (Cu-DLC) was prepared by a magnetron sputtering coating technique with a DC power supply under different substrate negative bias.The composition and phase structure of the film were characterized by EDS spectrum analyzer and X-ray diffraction analyzer (XRD).The tribological properties of the films were investigated by ball-disk rotary friction and wear tester.The morphology of the wear marks was analyzed by 3D ultra-depth microscope.The results shown that ①a series of Cu-DLC films were successfully prepared on 304 stainless steel.When there was no negative bias,the film had a low copper content and poor tribological properties.After adding a negative bias,the copper content of the films increased,However,as the negative bias increased,the amount of copper was gradually reduced.②The doping of Cu element can effectively reduce the friction coefficient of the films,and the prepared film had a lower friction coefficient (below 0.1)and achieved low friction.③The substrate negative bias significantly affected the element doping amount and film quality of the films,When the negative bias voltage was 100V,the film had the highest copper content,and the tribological properties of the films were the best.The friction coefficient was 0.0669 and the wear rate was the smallest of 9.87×10-5mm3/(N·m).
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