为了降低固化温度,设计了一种80℃条件下由阻尼材料、碳纤维/酚醛树脂基体材料组成的共固化阻尼复合材料。应用分子动力学对阻尼材料和酚醛树脂基体材料进行共固化模拟分析,计算二者发生化学反应的自由能,并通过傅里叶变换红外光谱仪对模拟结果进行可行性验证。由正交试验得到与基体材料在80℃共固化的阻尼材料组分,并按铺层工艺和共固化工艺制备出低温阻尼复合材料,探究了低温阻尼复合材料的阻尼性能及界面结合性能随阻尼层厚度变化的规律。结果表明:丁腈橡胶作为阻尼材料具有较好的阻尼性能;随着阻尼层厚度的减小,复合材料层间剪切强度逐渐增大,界面结合性能较好,当阻尼层厚度为0.1mm时,层间剪切强度达到6.2MPa。
In order to reduce the curing temperature,a co-cured damping composite consisting of damping material and carbon fiber/phenolic resin matrix material at 80℃ was designed.Molecular dynamics (MD) was used to simulate the co-curing of damping and resin matrix materials,calculate the free energy of chemical reaction between them,and verify the feasibility of the simulation results through Fourier infrared spectroscopy test.The damping material components co-cured with the matrix material at 80℃ were obtained from the orthogonal experiment,and damping composites were prepared according to the laying process and co-curing process.Furthermore,the regular between the damping properties and the interface bonding properties of low temperature damping composites with the thickness of damping layer was investigated.The results showed that NBR had better damping properties as a damping material.With the decrease of damping layer thickness,the interlaminar strength of the composite increased gradually,and the interface bonding property was good.When the thickness was 0.1mm,the interlaminar shear strength reached 6.2MPa.
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