中空玻璃微球/聚酰亚胺复合薄膜的制备及性能研究

马馨雨1, 刘立柱1,2*, 翁凌1,2, 董馨茜1

化工新型材料 ›› 2018, Vol. 46 ›› Issue (12) : 104 -107.

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化工新型材料 ›› 2018, Vol. 46 ›› Issue (12) : 104-107.
新材料与新技术

中空玻璃微球/聚酰亚胺复合薄膜的制备及性能研究

    马馨雨1, 刘立柱1,2*, 翁凌1,2, 董馨茜1
作者信息 +

Preperation and performance of HGM-polyimide composite film

  • Ma Xinyu1, Liu Lizhu1,2, Weng Ling1,2, Dong Xinqian1
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文章历史 +
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摘要

采用硅烷偶联剂KH550和KH560对中空玻璃微球进行改性,以均苯四甲酸二酐和4,4′-二氨基二苯醚为原材料,N,N-二甲基乙酰胺为溶剂,采用原位聚合法制得中空玻璃微球/聚酰亚胺复合薄膜。通过红外光谱和扫描电子显微镜对中空玻璃微球的改性情况进行表征。结果表明:硅烷偶联剂成功接枝到了玻璃微球表面。随着玻璃微球质量分数的提高,复合薄膜的力学性能在一定程度上有所下降,但介电常数却有明显的降低。填充未改性空心中空玻璃微球的复合薄膜,其介电常数从3.5降至2.4,KH550改性后的复合薄膜的介电常数最低可以达到2.0左右。

Abstract

The surface of hollow glass microspheres(HGM) was modified with different silane coupling agents KH550 and KH560.The hollow glass microspheres/polyimide composite films were prepared by in-situ polymerization using pyromellitic dianhydride and 4,4′-diaminodiphenyl ether as raw materials and N,N-dimethylacetamide as solvent.The modification of microspheres was characterized by FT-IR and scanning electron microscope(SEM).The results showed that silane coupling agents are successfully grafted onto microsphere surface.With the doping content of microspheres increased,the mechanical properties decreased to a certain extent.However,the dielectric properties of composite films were reduced obviously.The dielectric constant of film filled with unmodified hollow glass microspheres decreased from 3.5 to 2.4.The minimum dielectric constant of film modified by KH550 could reach about 2.

关键词

中空玻璃微球 / 硅烷偶联剂 / 聚酰亚胺 / 复合薄膜 / 介电常数

Key words

hollow glass microsphere (HGM) / silane coupling agent / polyimide / composite film / dielectric constant

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中空玻璃微球/聚酰亚胺复合薄膜的制备及性能研究[J]. 化工新型材料, 2018, 46(12): 104-107 DOI:

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