以丙烯酸树脂作为微胶囊壁材溶液包覆铜粉,石墨烯作为导电增强相,制备了石墨烯-微胶囊铜复合电子浆料。利用金属电导率测试仪、X射线衍射仪、四探针测试仪和扫描电子显微镜分别研究了微胶囊铜粉的电导率及其抗氧化性能,分析了石墨烯对石墨烯-微胶囊铜复合电子浆料导电性能的影响。结果表明:微胶囊铜粉与未包覆铜粉相比,电导率明显提高,且当增重率为4%(wt,质量分数)时,电导率达到最大值41.30% IACS,且不存在CuO或Cu2O;石墨烯的加入对铜复合电子浆料的导电性能有增强作用,但不同类型石墨烯的增强效果不同,导电性能主要与石墨烯的片径、厚度、纯度相关,其中片径约5μm,厚度为1～5nm的石墨烯纳米片作为导电增强相制备的铜复合电子浆料导电性能最优。
Acrylic resin was chosen as a microcapsule wall material to coat the copper powders,graphene was as an enhanced phase to prepare copper electronic paste.The conductivity and oxidation resistance of microencapsulated copper powders were investigated by metal conductivity tester,XRD diffractometer,four-probe tester and scanning electron microscope (SEM),the effect of graphene on the electrical conductivity of copper composite paste was analyzed.Results showed that compared with the uncoated copper powders,the conductivity of microencapsulated copper powders was obviously increased.When the weight gain rate was 4wt%,the conductivity reached the maximum value of 41.30% IACS and there were no CuO or Cu2O.The addition of graphene had enhance effect on paste,but the enhancement effect of variety of graphene was different.Electrical conductivity was mainly related to the size,thickness,purity of graphene.Graphene with about 5 μm size and 1～5nm thickness was used to prepare copper composite paste,in which the conductivity was best.
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基金资助
陕西省科学技术研究发展计划-工业攻关资助项目(2013K09-33);西安市科技计划项目——产学研协同创新计划(CXY1517(3));西安市科技计划项目-高校院所人才服务企业工程[2017074CG/RC037(XAGC002)];西安市科技计划项目-高校院所人才服务企业工程[2017074CG/RC037(XAGC007)]
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