铬包覆的金刚石颗粒增强铜基复合材料的热物理性能研究

朱聪旭1, 申铮源1, 武玺旺1, 李柯柯2, 陈超1

化工新型材料 ›› 2018, Vol. 46 ›› Issue (4) : 66 -69.

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化工新型材料 ›› 2018, Vol. 46 ›› Issue (4) : 66-69.
新材料与新技术

铬包覆的金刚石颗粒增强铜基复合材料的热物理性能研究

    朱聪旭1, 申铮源1, 武玺旺1, 李柯柯2, 陈超1
作者信息 +

Study on thermal-physical property of Cr-coated diamond particle reinforced copper matrix composite

  • Zhu Congxu1, Shen Zhengyuan1, Wu Xiwang1, Li Keke2, Chen Chao1
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摘要

通过混合熔盐法将NaCl、KCl、金刚石颗粒及微量活性物质铬粉按一定比例混合均匀后煅烧处理,经过充分清洗、过筛及干燥等工艺得到了铬包覆的金刚石颗粒;利用放电等离子烧制技术制备了具有优异热物理性能的铬包覆金刚石颗粒增强铜基复合散热材料。结果表明:采用该混合熔盐法能够实现金刚石颗粒表面铬全包覆;铬包覆的金刚石颗粒与铜基体金属材料的界面结合良好;采用放电等离子技术制备的铬包覆金刚石-铜基复合材料具有较高的相对密度、优异的热传导性能及相对较低的热膨胀系数。

Abstract

Cr-coated diamond particles were obtained by blending evenly the raw materials including chromium powder,NaCl,KCl and diamond particles according to a certain proportion used the mixed molten salt method.Cr-coated diamond particle reinforced Cu matrix composites with excellent thermal and physical properties were prepared by spark plasma sintering.The results showed that the chromium complete coating on the surface of diamond particles can be achieved by using the mixed molten salt method.The interfacial bonding between Cr-coated diamond particles and Cu matrix metallic materials was excellent.Cr-coated diamond/copper composites prepared by spark plasma sintering had high relative density,excellent thermal conductivity and relatively low thermal expansion coefficient.

关键词

金刚石 / 铬包覆 / 复合材料 / 热导率

Key words

diamond / Cr-coating / composite / thermal conductivity

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铬包覆的金刚石颗粒增强铜基复合材料的热物理性能研究[J]. 化工新型材料, 2018, 46(4): 66-69 DOI:

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参考文献

[1] Yasutomo S,Hideto I,Kenichiro I.Structrally uniform and atomically precise carbon nanostructures[J].Nature Reviews Materials,2016,1(2):1-11.
[2] Chen Q,Ji W,Chen S.Direct synthesis of multicolor fluorescent hollow carbon spheres encapsulating enriched carbon dots[J].Scientific Reports,2016,6(19382):1-8.
[3] Liao W,Yang S,Wang J,et al.Effect of molecular chain length on the mechanical and thermal properties of amine-functionalized grapheme oxide/polyimide composite films prepared by in situ polymerization[J].ACS Appl Mater Interfaces,2013,5(3):869-877.
[4] Virendra S,Bougher T,Annie W,et al.High thermal conductivity of chain-oriented amorphous polythiophene[J].Nature Nanotechnology,2014,9(5):384-390.
[5] Yuan G,Li X,Dong Z,et al.Pitch-based ribbon-shaped carbon-fiber-reinforced one-dimensional carbon/carbon composites with ultrahigh thermal conductivity[J].Carbon,2014,68(3):413-425.
[6] Balandin A.Thermal properties of graphene and nanostructured carbon materials[J].Nature Materials,2011,10(8):569-581.
[7] Yan Z,Liu G,Khan J,et al.Graphene quilts for thermal management of high-power GaN transistors[J].Nature Communications,2012,3(3):827-835.
[8] Zhu C,Zhao H,Fa W,et al.Processing of diamond particle dispersed silicon(Ti) matrix composites by in-situ reactive sintering and their thermal properties[J].Ceramics International,2014,40(5):7467-7472.
[9] Shen W,Shao W,Wang Q,et al.Thermal conductivity and thermal expansion coeffient of diamond/5wt% Si-Cu composite by vacuum hot pressing[J].Fusion Engineering and Design,2010,85(10):2237-2240.
[10] Li Y,Jiang H,Pang L,et al.Novel application of nanocrystalline nickel eletrodeposit:making good diamond tools easily,efficiently and economically[J].Surface and Coatings Technology,2007,201(12):5925-5930.
[11] Hatsuo L,Saraunt R.Very high thermal conductivity obtained by boron nitride-filled polybenzoxaine[J].Thermochemical Acta,1998,320(1):177-186.
[12] Yuan G,Li X,Dong Z,et al.Graphite blocks with preferred orientation and high thermal conductivity[J].Carbon,2012,50(1):175-182.
[13] Chu K,Liu Z,Jia C,et al.Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles[J].Journal of Alloys and Compounds,2010,490(1):453-458.
[14] Zhu C,Wang C,Lang J,et al.Si-coated diamond particles reinforced copper composites fabricated by spark plasma sintering process[J].Materials and Manufacturing Processes,2013,28(2):143-147.
[15] Ciupinski L,Kruszewski M,Grzonka J,et al.Design of interfacial Cr3C2 carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applications[J].Materials & Design,2017,120(1):170-185.
[16] Raza K,Khalid F.Optimization of sintering parameters for diamond-copper composites in conventional sintering and their thermal conductivity[J].Journal of Alloys and Compounds,2014,615(8):111-118.
[17] Hasselman D,Johnson L.Effective thermal conductivity of composites with interfacial thermal barrier resistance[J].J Compos Mater,1987,21(6):1011-1013.
[18] Bai H,Ma N,Lang J,et al.Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder[J].Composites Part B,2013,52(9):182-186.
[19] Majumdar A,Reddy P.Role of electron-phonon coupling in thermal conductance of metal-nonmetal interfaces[J].Appl Phys Lett,2004,84(23):4768-4770.
[20] Maldovan M.Phonon wave interference and thermal bandgap materials[J].Nature Materials,2015,14(7):667-674.
[21] Turner P.Thermal-expansion stresses in reinforced plastics[J].J Res NBS,1946,37(1):239-250.
[22] Passler R.Limiting debye temperature behavior following from cryogenic heat capacity data for group-Ⅳ,Ⅲ-Ⅴ,and Ⅱ-Ⅵ materials[J].Phys Status Solidi B,2010,247(1):77-92.

基金资助

河南省自然科学基金(162300410036);国家自然科学基金联合基金(U1604121)

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