The curing reaction of 4,4'-diaminodiphenylsulfone (DDS) and 4,4'-diaminodiphenylmethane (DDM) with Schiff base epoxy resin(EP) 4,4'-dihydroxydiphenylimine (DEI) were studied by dynamic differential scanning calorimetry (DSC).According to the curing reaction parameters of DSC at different heating rates,the average activation energies of DEI with DDS and DDM were obtained as 72.75kJ/mol and 68.99kJ/mol respectively by Kissinger,Ozawa and Flynn-Wall-Ozawa methods.In addition,the curing temperature and curing time of DEI,DDS and DDM were determined by the relationship between curing reaction temperature and heating rate.
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