Replacing traditional precious metal silver paste with copper conductive paste is one of the important directions for the development of electronic paste.The technical requirements of the zinc oxide(ZnO) varistor for the conductor paste (sintering temperature can not be higher than 600℃,otherwise the varistor electrical performance of the device will be reduced),a suitable amount of Ag was added to the copper paste.The copper electrode paste was printed on the surface of the ZnO pressure-sensitive substrate,and subjected to sintering treatment to obtain a conductive copper film.The microstructure of conductive copper film was observed by scanning electron microscope,and the resistivity was measured by four-probe method.The effects of the type of copper powder,the amount of silver added and the addition method on the sintering process and the properties of the copper film were investigated.The results shown that adding 4.5wt% of Ag in the copper slurry can improve the sintering activity of the copper powder in the slurry,and obtained copper electrode film with good bonding and conductivity at a lower sintering temperature (600℃).Compared with silver-powder,silver coated copper powder had better distribution uniformity and connection in slurry when silver was added.