Mixed silane was used as the raw material to prepare solvent-free one-component organosilicon impregnating resin by hydrolysis and polycondensation reaction.The effects of Si-H group,Si-Vi group and Si-Ph group molar content and kinematic viscosity on the properties of the resin were investigated.The results showed that:when the Si-H group molar content was 3.2%,Si-Vi group molar content was 7.9%,Si-Ph group molar content was 45% and the dynamic viscosity was 1300mPa·s,the resin shown the low dielectric constant,the best mechanical properties and the excellent thermal stability.
Hou Xinrui, Song Huafeng, Liu Meichen, Li Meijiang
. Study on property of solvent-free one-component organosilicon impregnating resin[J]. New Chemical Materials, 2021
, 49(9)
: 84
-88
.
DOI: 10.19817/j.cnki.issn 1006-3536.2021.09.018
[1] 张保坦,李茹,陈修宁,等.LED封装材料的研究进展[J].化工新型材料,2010(S1):23-27.
[2] Chen G,Guan X,Xu R,et al.Synthesis and characterization of UV-curable castor oil-based polyfunctional polyurethane acrylate via photo-click chemistry and isocyanate polyurethane reaction[J].Progress in Organic Coatings,2016,93:11-16.
[3] 王婷婷.含氢苯基硅树脂的合成及其在LED封装材料中的应用[D].西安:陕西科技大学,2016.
[4] 孙举涛,黄玉东,曹海琳,等.耐高温有机硅树脂的合成及其耐热和固化性能研究[J].航空材料学报,2005(1):27-29.
[5] 陈智栋,邓雪爽,彭银波,等.发光二极管(LED)封装用高折射率有机硅树脂的合成[J].化工新型材料,2010,11:49-52.
[6] 郑梓聪.LED封装用硅树脂的制备与性能[D].广州:华南理工大学,2017.
[7] Zwiers R J M,Bressers H J L,Ouwehand B,et al.Development of a new low-stress hyperred LED encapsulant[J].IEEE Transactions on Components,Hybrids,and Manufacturing,Technology,1989,12(3):387-392.
[8] 张宇鸥,李岳,孙禹,等.缩合型双组分室温硫化高强度低介电常数有机硅胶黏剂的研制[J].化学与粘合,2017(2).105-108.
