Epoxy resin(EP) SRTEM-80/REDG-80/E-158 was Modified by methyl hexahydrophthalic anhydride (MeHHPA) as curing agent and carboxyl-terminated liquid nitrile rubber (CTBN) as toughening agent.Coupling agent KH-570 modified alumina and silica powder compounding filler were used to prepare EP encapsulant for IGBT.The viscosity,gelation time,thermal conductivity,electrical properties,flexural strength of the encapsulant,water absorption and so on were tested.The research shown that the EP encapsulant had low viscosity,insulation performance,moisture resistance,etc..When the amount of silane coupling agent KH-570 was 1.5%,the thermal conductivity of the encapsulant was 1.191W,and the volume resistivity was 5.95×1015Ω·m.The breakdown field strength was 28.28kV/mm,the tgδ was 0.62%,the bending strength was 74.32MPa,and the water absorption was less than 0.1%.The best curing process was 80℃/2h,120℃/2h.
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