Abstract: Polyhedral oligomer polysiloxane (NH2-POSS) with amino terminal was prepared by hydrolytic condensation,and the NH2-POSS was used as the “diamine” of polyimide,mixed with 4,4′-diaminodiphenyl ether (ODA) and pyromellitic dianhydride (PMDA) to obtain binary copolymerized polyamide acid (PAA) solution was by in-situ polymerization.The amino ratio of NH2-POSS in the copolymerized PAA solution was determined by the dichotomy method,and the film was prepared by thermal imidization.The effects of NH2-POSS on the properties of copolymer films in different proportions were explored.The properties of copolymer films were characterized by infrared spectroscopy,thermogravimetric analyzer,universal testing machine and broadband dielectric impedance spectrometer.The results showed that the copolymer film had comparable thermal stability (545℃,5wt%) and mechanical properties (tensile strength 90~122MPa) to pure polyimide film,and had a lower dielectric constant (25% POSS-PI film,106Hz dielectric constant 2.8).
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