有机载体对石墨烯-铜复合浆料性能的影响
屈银虎, 时晶晶, 成小乐, 周宗团, 祁志旭, 袁建才, 左文婧, 王蕾
西安工程大学机电工程学院,西安710048
Influence of organic carrier on the property of copper composite paste
Qu Yinhu, Shi Jingjing, Cheng Xiaole, Zhou Zongtuan, Qi Zhixu, Yuan Jiancai, Zuo Wenjing, Wang Lei
College of Mechanical and Electronic Engineering,Xi'an Polytechnic University,Xi'an 710048
摘要 提高铜浆的导电性,选用松油醇-乙基纤维素系列有机载体,粒径为10μm的铜粉为主导电相,添加少量石墨烯为导电增强相,熔点为430℃的玻璃粉为粘结剂,按一定质量分数配合比混合制备石墨烯-铜复合浆料。并利用四探针测试仪、扫描电子显微镜(SEM)等分析测试研究有机载体对石墨烯-铜复合浆料性能的影响。结果表明:乙基纤维素、松油醇、消泡剂、硅烷偶联剂、乙酸乙酯的质量分数配合比为4.75∶82.18∶2.57∶5.37∶5.13条件下制得的有机载体性能较好;有机载体用量为20%(wt,质量分数)条件下,制得的石墨烯-铜复合浆料在丝网印刷过程中能够获得平整的印刷结构,具有较小的电阻率,为17.14mΩ·cm;添加少量石墨烯后复合铜浆电阻率比纯铜浆料降低了50.22%。
关键词:
铜粉
石墨烯
复合浆料
有机载体
Abstract: To improve the conductivity of copper paste,the 10μm copper powders as the main conductive phase were proportionally mixed with a small amount of graphene as the conductive reinforced phase,glass powders of 430℃ and the terpineol-ethocel organic carrier.The influences of organic carrier on paste were characterized by Four-Point probe,scanning electron microscopy (SEM) and other testing methods.The results showed that the organic carrier had a better property when the mass fraction of ethocel,defoamer,terpineol,silane coupling agent and acetic ether of 4.75∶82.18∶2.57∶5.37∶5.13.The paste with 20wt% organic carrier obtained a flat structure by screen printing.The paste with 20wt% organic carrier had a smaller resistivity of 17.14mΩ·cm.The resistivity of paste with a small amount of graphene was decreased by 50.22% compared to the copper paste.
Key words:
copper powder
graphene
composite paste
organic carrier
收稿日期: 2017-03-28
发布日期: 2018-11-05
期的出版日期: 2018-09-20
基金资助: 陕西省科学技术研究发展计划工业攻关项目(2013K09-33);陕西省教育厅科学研究计划项目(15JK1332);陕西省教育厅服务地方专项计划项目(14JF007);西安市科技计划项目-产学研协同创新计划(CXY1517(3));西安市科技计划项目-高校院所人才服务企业工程(2017074CG/RC037,XAGC002);西安市科技计划项目-高校院所人才服务企业工程(2017074CG/RC037,XAGC007);陕西省重点研发计划项目(S2018-JC-YB-1093)
作者简介: 屈银虎(1962-),男,教授,主要从事电子浆料研究。
引用本文:
屈银虎, 时晶晶, 成小乐, 周宗团, 祁志旭, 袁建才, 左文婧, 王蕾. 有机载体对石墨烯-铜复合浆料性能的影响[J]. 化工新型材料, 2018, 46(9): 170-173.
Qu Yinhu, Shi Jingjing, Cheng Xiaole, Zhou Zongtuan, Qi Zhixu, Yuan Jiancai, Zuo Wenjing, Wang Lei. Influence of organic carrier on the property of copper composite paste. New Chemical Materials, 2018, 46(9): 170-173.
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http://www.hgxx.org/CN/Y2018/V46/I9/170
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