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化工新型材料  2018, Vol. 46 Issue (8): 63-66    
  新材料与新技术 本期目录 | 过刊浏览 | 高级检索 |
氧化铝/环氧树脂复合材料的制备及散热性能研究
吴聪, 都怡佩, 沈意斌, 汤玉斐, 赵康*
西安理工大学材料科学与工程学院,西安710048
Preparation and thermal property of alumina/epoxy resin composite
Wu Cong, Dou Yipei, Shen Yibin, Tang Yufei, Zhao Kang
School of Materials Science and Engineering,Xi´an University of Technology,Xi´an 710048
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摘要 针对目前LED散热材料导热系数不高的问题,采用粉末冶金法制备氧化铝/环氧树脂复合散热材料,研究了氧化铝粒径、添加量以及加入金属对复合材料导热系数的影响;分析了不同粒径、固化温度对其抗弯强度的影响,对于获得高性能LED散热材料具有很高的参考价值。结果表明:当氧化铝颗粒的粒径为50μm、填充量为75%(体积分数,下同)时,加入10% Cu所制备的复合材料其导热系数达到最大值3.02W/(m·K),同时其耐击穿电压高于行业标准。
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吴聪
都怡佩
沈意斌
汤玉斐
赵康
关键词:  氧化铝  环氧树脂  散热材料  热导率    
Abstract: In view of the problem that the thermal conductivity of LED thermal insulation material is not high,alumina/epoxy resin composites heat dissipation material was prepared by powder metallurgy method.The effect of alumina particle size,addition amount and adding metal on thermal conductivity of composite were studied.Further,the influence of alumina particle size and sintering temperature on the bending strength were analyzed,which was of great reference value for obtaining high performance LED heat dissipation material.It was revealed that the thermal conductivity of composite can reach the maximum value of 3.02W/(m·K) when the particle size of the alumina particles was 50μm and the filling capacity was 75 vol.% as well as adding 10vol.% Cu,and its breakdown voltage was higher than the industry standard.
Key words:  alumina    epoxy resin    heat dissipation material    thermal conductivity
收稿日期:  2017-04-07                     发布日期:  2018-09-18      期的出版日期:  2018-08-20
基金资助: 国家自然科学基金(51372199);中国博士后科学基金(2015M582689);陕西省大学生创新创业训练计划(1094)
通讯作者:  赵康(1963-),男,教授,博士研究生导师。   
作者简介:  吴聪(1991-),男,博士研究生,主要从事功能陶瓷的研究。
引用本文:    
吴聪, 都怡佩, 沈意斌, 汤玉斐, 赵康. 氧化铝/环氧树脂复合材料的制备及散热性能研究[J]. 化工新型材料, 2018, 46(8): 63-66.
Wu Cong, Dou Yipei, Shen Yibin, Tang Yufei, Zhao Kang. Preparation and thermal property of alumina/epoxy resin composite. New Chemical Materials, 2018, 46(8): 63-66.
链接本文:  
http://www.hgxx.org/CN/  或          http://www.hgxx.org/CN/Y2018/V46/I8/63
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